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XC2S150E-6FGG456I

Xilinx
RoHS
/
Package FBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description CMOS RoHS Compliant BALL BOTTOM field programmable gate array 100C 6kB 0.47ns 357MHz
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Technical Details

Physical

Package / Case FBGA
Surface Mount YES

Dimensions

Length 23mm
Width 23mm

Compliance

Radiation Hardening No
RoHS Status RoHS Compliant

Technical

JESD-609 Code e1
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3
Number of Terminations 456
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Additional Feature MAXIMUM USABLE GATES = 150000
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 456
Number of Outputs 265
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 1.89V
RAM Size 6kB
Clock Frequency 357MHz
Number of Inputs 265
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Speed Grade 6
Combinatorial Delay of a CLB-Max 0.47 ns
Number of CLBs 864
Number of Logic Cells 3888
Number of Equivalent Gates 52000

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