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XC2S300E-7FG456C

Xilinx
RoHS
/
Package FBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description CMOS COMMERCIAL EXTENDED 2008 RoHS Compliant field programmable gate array 85C 8kB 0.42ns 400MHz
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Technical Details

Physical

Package / Case FBGA
Surface Mount YES

Technical

Published 2008
JESD-609 Code e0
Pbfree Code no
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3
Number of Terminations 456
ECCN Code 3A991.D
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Additional Feature MAXIMUM USABLE GATES = 300000
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 456
JESD-30 Code S-PBGA-B456
Number of Outputs 329
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 1.89V
Temperature Grade COMMERCIAL EXTENDED
RAM Size 8kB
Clock Frequency 400MHz
Number of Inputs 329
Organization 1536 CLBS, 93000 GATES
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Speed Grade 7
Combinatorial Delay of a CLB-Max 0.42 ns
Number of CLBs 1536
Number of Logic Cells 6912
Number of Equivalent Gates 93000

Dimensions

Height Seated (Max) 2.6mm
Length 23mm
Width 23mm

Compliance

Radiation Hardening No
RoHS Status RoHS Compliant

Alternative Model

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