Operating Temperature -55°C~250°C
Packaging Bulk
Published 2011
Series TMC
Size / Dimension 1.968Lx1.140W 49.99mmx28.96mm
Tolerance ±1%
JESD-609 Code e4
Feature Moisture Resistant
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Temperature Coefficient ±20ppm/°C
Resistance 12Ohm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Composition Wirewound
Additional Feature POWER DISSIPATED USING HEAT SINK : 50
Packing Method CARD PACK
Max Power Dissipation 50W
Technology WIRE WOUND
Resistor Type FIXED RESISTOR
Reach Compliance Code unknown
Rated Power Dissipation (P) 20W
Lead Style Solder Lugs
Lead/Base Style Solder
Coating, Housing Type Aluminum