Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2003
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 165
ECCN Code 3A991.B.2.A
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Additional Feature PIPELINED ARCHITECTURE
HTS Code 8542.32.00.41
Technology SRAM - Synchronous, QDR II+
Voltage - Supply 1.7V~1.9V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Supply Voltage-Max (Vsup) 1.9V
Supply Voltage-Min (Vsup) 1.7V
Memory Size 72Mb 2M x 36
Memory Type Volatile
Clock Frequency 333MHz
Memory Format SRAM
Memory Interface Parallel
Organization 2MX36
Memory Width 36
Memory Density 75497472 bit
Access Time (Max) 0.45 ns