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CYPT1544AV18-250GCMB

Cypress Semiconductor Corp
RoHS
/
Package 165-BFCCGA
Category Integrated Circuits (ICs) / Memory
Description 3A001.A.1.C Through Hole Tray SRAM - Synchronous QDR II+ ic memory 250MHz 0.85ns 5.38mm 72Mb
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Technical Details

Supply Chain

Factory Lead Time 20 Weeks

Technical

Operating Temperature -55°C~125°C TA
Packaging Tray
Published 2003
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 165
ECCN Code 3A001.A.1.C
Terminal Finish TIN LEAD
Technology SRAM - Synchronous, QDR II+
Voltage - Supply 1.7V~1.9V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 1.8V
Time@Peak Reflow Temperature-Max (s) 30
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 1.9V
Supply Voltage-Min (Vsup) 1.7V
Memory Size 72Mb 2M x 36
Number of Ports 2
Memory Type Volatile
Clock Frequency 250MHz
Memory Format SRAM
Memory Interface Parallel
Memory Width 36
Address Bus Width 40b
Density 72 Mb
Access Time (Max) 0.85 ns
Sync/Async Synchronous
Word Size 36b
Total Dose 300k Rad(Si) V

Physical

Mount Through Hole
Mounting Type Through Hole
Package / Case 165-BFCCGA
Number of Pins 165

Compliance

REACH SVHC Unknown
RoHS Status Non-RoHS Compliant

Dimensions

Height Seated (Max) 5.38mm

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