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IS61NLP25672-200B1

ISSI, Integrated Silicon Solution Inc
RoHS
/
Package 209-BGA
Category Integrated Circuits (ICs) / Memory
Description 3A991.B.2.A Surface Mount Tray 256KX72 ic memory 200MHz 3.1ns 14mm 0.06A
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Technical Details

Physical

Mounting Type Surface Mount
Package / Case 209-BGA
Surface Mount YES
Number of Pins 209

Dimensions

Height Seated (Max) 1.95mm
Length 22mm
Width 14mm

Technical

Operating Temperature 0°C~70°C TA
Packaging Tray
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 2 (1 Year)
Number of Terminations 209
ECCN Code 3A991.B.2.A
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature PIPELINED ARCHITECTURE
HTS Code 8542.32.00.41
Technology SRAM - Synchronous, SDR
Voltage - Supply 3.135V~3.465V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 209
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.465V
Power Supplies 2.5/3.33.3V
Supply Voltage-Min (Vsup) 3.135V
Memory Size 18Mb 256K x 72
Memory Type Volatile
Clock Frequency 200MHz
Supply Current-Max 0.55mA
Access Time 3.1ns
Memory Format SRAM
Memory Interface Parallel
Organization 256KX72
Output Characteristics 3-STATE
Memory Width 72
Standby Current-Max 0.06A
Memory Density 18874368 bit
I/O Type COMMON
Standby Voltage-Min 3.14V

Compliance

RoHS Status Non-RoHS Compliant

Alternative Model

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