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NAND256W3A0BZA6E

Micron Technology Inc.
RoHS
RoHS RoHS compliant
Package 55-TFBGA
Category Integrated Circuits (ICs) / Memory
Description Asynchronous Obsolete 2013 BOTTOM ic memory -40C~85C TA 2.7V 256Mb 20mA
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Technical Details

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 55-TFBGA
Number of Pins 55

Dimensions

Height Seated (Max) 1.05mm
Length 10mm

Technical

Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2013
JESD-609 Code e1
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 55
ECCN Code 3A991.B.1.A
Terminal Finish TIN SILVER COPPER
HTS Code 8542.32.00.51
Technology FLASH - NAND
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number NAND256-A
Pin Count 55
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 256Mb 32M x 8
Nominal Supply Current 20mA
Memory Type Non-Volatile
Memory Format FLASH
Memory Interface Parallel
Organization 32MX8
Memory Width 8
Write Cycle Time - Word, Page 50ns
Address Bus Width 25b
Density 256 Mb
Standby Current-Max 0.00005A
Access Time (Max) 35 ns
Sync/Async Asynchronous
Word Size 8b
Programming Voltage 3V
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 2K
Sector Size 16K
Page Size 512words
Ready/Busy YES

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