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IS61DDB22M18A-250B4LI

ISSI, Integrated Silicon Solution Inc
RoHS
RoHS RoHS compliant
Package 165-LBGA
Category Integrated Circuits (ICs) / Memory
Description Discontinued BOTTOM Volatile ROHS3Compliant ic memory -40C~85C TA 1.71V 37748736bit 13mm
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Technical Details

Physical

Mounting Type Surface Mount
Package / Case 165-LBGA
Surface Mount YES
Number of Pins 165

Dimensions

Height Seated (Max) 1.4mm
Length 15mm
Width 13mm

Technical

Operating Temperature -40°C~85°C TA
Packaging Tray
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 165
ECCN Code 3A991.B.2.A
Additional Feature PIPELINED ARCHITECTURE
HTS Code 8542.32.00.41
Technology SRAM - Synchronous, DDR II
Voltage - Supply 1.71V~1.89V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 165
Supply Voltage-Max (Vsup) 1.89V
Supply Voltage-Min (Vsup) 1.71V
Memory Size 36Mb 2M x 18
Memory Type Volatile
Clock Frequency 250MHz
Access Time 8.4ns
Memory Format SRAM
Memory Interface Parallel
Organization 2MX18
Memory Width 18
Memory Density 37748736 bit

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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