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W25Q64JVDAIQ

Winbond Electronics
RoHS
RoHS RoHS compliant
Package 8-DIP (0.300, 7.62mm)
Category Integrated Circuits (ICs) / Memory
Description 3A991.B.1.A Through Hole Tube 64MX1 ic memory 133MHz 3ms 7.62mm 67108864bit
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Technical Details

Physical

Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO

Technical

Operating Temperature -40°C~85°C TA
Packaging Tube
Published 2016
Series SpiFlash?
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code 3A991.B.1.A
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 2.54mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PDIP-T8
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Interface SPI, Serial
Memory Size 64Mb 8M x 8
Memory Type Non-Volatile
Operating Mode SYNCHRONOUS
Clock Frequency 133MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O
Organization 64MX1
Memory Width 1
Write Cycle Time - Word, Page 3ms
Memory Density 67108864 bit
Programming Voltage 2.7V

Compliance

RoHS Status ROHS3 Compliant

Dimensions

Height Seated (Max) 5.33mm
Length 9.27mm
Width 7.62mm

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