Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2002
Series e?MMC?
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 153
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Technology FLASH - NAND
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code R-PBGA-B153
Memory Size 64Gb 8G x 8
Memory Type Non-Volatile
Memory Format FLASH
Memory Interface MMC
External Data Bus Width 8
Host Data Transfer Rate-Max 190 MBps