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RoHS
RoHS RoHS compliant
Package 165-TBGA
Category Integrated Circuits (ICs) / Memory
Description Active 3-STATE BOTTOM Volatile ic memory 0C~70C TA 2.375V 18874368bit 0.06A
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Technical Details

Physical

Mounting Type Surface Mount
Package / Case 165-TBGA
Surface Mount YES
Number of Pins 165

Technical

Operating Temperature 0°C~70°C TA
Packaging Tray
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 165
ECCN Code 3A991.B.2.A
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature FLOW-THROUGH ARCHITECTURE
HTS Code 8542.32.00.41
Technology SRAM - Synchronous, SDR
Voltage - Supply 2.375V~2.625V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 165
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 2.5V
Supply Voltage-Min (Vsup) 2.375V
Memory Size 18Mb 1M x 18
Memory Type Volatile
Clock Frequency 133MHz
Supply Current-Max 0.45mA
Access Time 6.5ns
Memory Format SRAM
Memory Interface Parallel
Organization 1MX18
Output Characteristics 3-STATE
Memory Width 18
Standby Current-Max 0.06A
Memory Density 18874368 bit
I/O Type COMMON
Standby Voltage-Min 2.38V

Dimensions

Height Seated (Max) 1.2mm
Length 15mm
Width 13mm

Compliance

RoHS Status ROHS3 Compliant
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