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MT29F32G08CBEDBL83A3WC1

Micron Technology Inc.
RoHS
RoHS RoHS compliant
Package Die
Category Integrated Circuits (ICs) / Memory
Description Active Parallel Non-Volatile ROHS3Compliant ic memory 70C 2.7V~3.6V 32Gb 4G x 8
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Technical Details

Supply Chain

Factory Lead Time 3 Weeks

Technical

Operating Temperature 0°C~70°C TA
Packaging Bulk
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Technology FLASH - NAND
Voltage - Supply 2.7V~3.6V
Interface Parallel
Memory Size 32Gb 4G x 8
Memory Type Non-Volatile
Memory Format FLASH
Memory Interface Parallel

Compliance

RoHS Status ROHS3 Compliant

Physical

Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Die

Alternative Model

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