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MX25L6473EBBI-10G

Macronix
RoHS
RoHS RoHS compliant
Package 12-UFBGA, WLCSP
Category Integrated Circuits (ICs) / Memory
Description Not For New Designs SERIAL 2017 BOTTOM ic memory -40C~85C TA 2.7V 67108864bit 0.52mm
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Technical Details

Technical

Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Published 2017
Series MXSMIO?
JESD-609 Code e1
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3
Number of Terminations 12
Terminal Finish TIN SILVER COPPER
Additional Feature ALSO CONFIGURABLE AS 64M X 1
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code R-PBGA-B12
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 64Mb 8M x 8
Memory Type Non-Volatile
Operating Mode SYNCHRONOUS
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI
Organization 16MX4
Memory Width 4
Write Cycle Time - Word, Page 50μs, 3ms
Memory Density 67108864 bit
Parallel/Serial SERIAL
Programming Voltage 2.7V
Alternate Memory Width 2

Dimensions

Height Seated (Max) 0.52mm

Compliance

RoHS Status RoHS Compliant

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