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IS61DDPB21M18A-400M3L

ISSI, Integrated Silicon Solution Inc
RoHS
RoHS RoHS compliant
Package 165-LBGA
Category Integrated Circuits (ICs) / Memory
Description Active 3-STATE BOTTOM Volatile ic memory 0C~70C TA 1.71V 18874368bit 0.32A
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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Mounting Type Surface Mount
Package / Case 165-LBGA
Surface Mount YES
Number of Pins 165

Technical

Operating Temperature 0°C~70°C TA
Packaging Tray
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 165
ECCN Code 3A991.B.2.A
Terminal Finish TIN SILVER COPPER
Additional Feature PIPELINED ARCHITECTURE
HTS Code 8542.32.00.41
Technology SRAM - Synchronous, DDR IIP
Voltage - Supply 1.71V~1.89V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 165
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.89V
Power Supplies 1.8V
Supply Voltage-Min (Vsup) 1.71V
Memory Size 18Mb 1M x 18
Memory Type Volatile
Clock Frequency 400MHz
Supply Current-Max 0.75mA
Memory Format SRAM
Memory Interface Parallel
Organization 1MX18
Output Characteristics 3-STATE
Memory Width 18
Standby Current-Max 0.32A
Memory Density 18874368 bit
Access Time (Max) 0.45 ns
I/O Type COMMON

Dimensions

Height Seated (Max) 1.4mm
Length 17mm
Width 15mm

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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