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Package 54-TFBGA
Category Integrated Circuits (ICs) / Memory
Description Obsolete Copper Silver Tin 3-STATE BOTTOM ic memory -40C~85C TA 3V 64Mb 110mA
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Technical Details

Physical

Contact Plating Copper, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 54-TFBGA
Number of Pins 54

Dimensions

Height Seated (Max) 1.2mm
Length 8mm

Compliance

Radiation Hardening No
RoHS Status RoHS Compliant

Technical

Operating Temperature -40°C~85°C TA
Packaging Tray
JESD-609 Code e1
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 54
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature AUTO/SELF REFRESH
Technology SDRAM
Voltage - Supply 3V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 10
Pin Count 54
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Memory Size 64Mb 4M x 16
Number of Ports 1
Nominal Supply Current 110mA
Memory Type Volatile
Clock Frequency 143MHz
Access Time 5.4ns
Memory Format DRAM
Memory Interface Parallel
Data Bus Width 16b
Organization 4MX16
Output Characteristics 3-STATE
Memory Width 16
Address Bus Width 14b
Density 64 Mb
Standby Current-Max 0.003A
I/O Type COMMON
Refresh Cycles 4096
Sequential Burst Length 1248FP
Interleaved Burst Length 1248
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