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RoHS
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Package 0805 (2012 Metric)
Category Resistors / Chip Resistor - Surface Mount
Description Res Metal Foil 0805 969.7 Ohm 0.01% 1/5W 0.2ppm/C Molded SMD SMD Waffle Pack
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Technical Details

Physical

Contact Plating Lead, Tin
Package / Case 0805 (2012 Metric)
Supplier Device Package 0805

Technical

Operating Temperature -55°C~150°C
Packaging Tray
Series VSMP
Size / Dimension 0.080Lx0.050W 2.03mmx1.27mm
Tolerance ±0.01%
Feature Moisture Resistant, Non-Inductive
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Temperature Coefficient ±0.2ppm/°C
Resistance 969.7Ohms
Max Operating Temperature 150°C
Min Operating Temperature -55°C
Composition Metal Foil
Power (Watts) 0.2W 1/5W
Max Power Dissipation 200mW
Case Code (Metric) 2012
Case Code (Imperial) 0805

Dimensions

Height 635μm
Height Seated (Max) 0.025 0.64mm
Length 2.032mm
Width 1.27mm

Compliance

RoHS Status Non-RoHS Compliant
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