SN74LVC2G80YEPR

Rochester Electronics, LLC

RoHS

Package 8-XFBGA, DSBGA

Category Integrated Circuits (ICs) / Logic - Flip Flops

Description Tape & Reel (TR) e0 74LVC TIN LEAD flip flop 0.5mm 4.5ns @ 5V 50pF 160MHz 1.65V~5.5V

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Technical Details

Physical

Mounting Type Surface Mount

Package / Case 8-XFBGA, DSBGA

Surface Mount YES

Technical

Operating Temperature -40°C~85°C TA

Packaging Tape & Reel (TR)

Series 74LVC

JESD-609 Code e0

Pbfree Code no

Part Status Obsolete

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Number of Terminations 8

Type D-Type

Terminal Finish TIN LEAD

Technology CMOS

Voltage - Supply 1.65V~5.5V

Terminal Position BOTTOM

Terminal Form BALL

Peak Reflow Temperature (Cel) 260

Supply Voltage 1.8V

Terminal Pitch 0.5mm

Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

JESD-30 Code R-XBGA-B8

Function Standard

Qualification Status COMMERCIAL

Output Type Inverted

Number of Elements 2

Supply Voltage-Max (Vsup) 5.5V

Clock Frequency 160MHz

Family LVC/LCX/Z

Current - Quiescent (Iq) 5μA

Current - Output High, Low 32mA 32mA

Number of Bits per Element 1

Max Propagation Delay @ V, Max CL 4.5ns @ 5V, 50pF

Trigger Type Positive Edge

Input Capacitance 3.5pF

Dimensions

Height Seated (Max) 0.5mm

Width 0.9mm

Compliance

RoHS Status Non-RoHS Compliant

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