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BAP65-05,215

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package TO-236-3, SC-59, SOT-23-3
Category Discrete Semiconductor Products / Diodes - RF
Description RF DIODE PIN 30V 250MW TO236AB
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Technical Details

Supply Chain

Factory Lead Time 13 Weeks

Compliance

RoHS Status ROHS3 Compliant

Physical

Package / Case TO-236-3, SC-59, SOT-23-3
Surface Mount YES
Diode Element Material SILICON

Technical

Operating Temperature -65°C~150°C TJ
Packaging Tape & Reel (TR)
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3
Terminal Finish Tin (Sn)
HTS Code 8541.10.00.70
Subcategory PIN Diodes
Technology POSITIVE-INTRINSIC-NEGATIVE
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number BAP65-05
Pin Count 3
JESD-30 Code R-PDSO-G3
Qualification Status Not Qualified
Number of Elements 2
Configuration COMMON CATHODE, 2 ELEMENTS
Power Dissipation-Max 250mW
Diode Type PIN - 1 Pair Common Cathode
Application ATTENUATOR; SWITCHING
Current - Max 100mA
JEDEC-95 Code TO-236AB
Capacitance @ Vr, F 0.425pF @ 20V 1MHz
Voltage - Peak Reverse (Max) 30V
Breakdown Voltage-Min 30V
Diode Capacitance-Nom 0.7pF
Resistance @ If, F 350mOhm @ 100mA 100MHz
Diode Capacitance-Max 0.9pF
Minority Carrier Lifetime-Nom 0.17 μs
Diode Res Test Current 5mA
Diode Res Test Frequency 100MHz
Diode Forward Resistance-Max 0.9Ohm

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