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SSTUG32868ET/S,518

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 176-TFBGA
Category Integrated Circuits (ICs) / Logic - Specialty Logic
Description IC BUFFER 1.8V 25BIT 176-LFBGA
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Technical Details

Physical

Mounting Type Surface Mount
Package / Case 176-TFBGA
Surface Mount YES

Technical

Operating Temperature 0°C~85°C
Packaging Tape & Reel (TR)
Published 2007
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 176
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 1.7V~2V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number 74SSTUG32868
Pin Count 176
JESD-30 Code R-PBGA-B176
Qualification Status Not Qualified
Number of Bits 28
Output Characteristics OPEN-DRAIN
Logic Type 1:2 Configurable Registered Buffer with Parity
Output Polarity COMPLEMENTARY
Trigger Type POSITIVE EDGE
Propagation Delay (tpd) 1.5 ns
fmax-Min 450 MHz

Dimensions

Height Seated (Max) 1.15mm
Length 15mm
Width 6mm

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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