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SSTUG32865ET/G,518

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 160-TFBGA
Category Integrated Circuits (ICs) / Logic - Specialty Logic
Description IC BUFFER 1.8V 28BIT 160-TFBGA
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Technical Details

Physical

Mounting Type Surface Mount
Package / Case 160-TFBGA
Surface Mount YES

Dimensions

Height Seated (Max) 1.15mm
Length 13mm
Width 9mm

Compliance

RoHS Status ROHS3 Compliant

Technical

Operating Temperature 0°C~70°C
Packaging Tape & Reel (TR)
Published 2007
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 160
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 1.7V~2V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number 74SSTUG32865
Pin Count 160
JESD-30 Code R-PBGA-B160
Qualification Status Not Qualified
Number of Bits 28
Output Characteristics OPEN-DRAIN
Logic Type 1:2 Registered Buffer with Parity
Output Polarity TRUE
Trigger Type POSITIVE EDGE
Propagation Delay (tpd) 1.4 ns
fmax-Min 550 MHz

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