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LS1026AXN8P1A

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 780-FBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description QORIQ LAYERSCAPE 2XA72 64BIT ARM
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Technical Details

Supply Chain

Factory Lead Time 18 Weeks

Physical

Package / Case 780-FBGA, FCBGA
Surface Mount YES

Technical

Operating Temperature -40°C~105°C
Packaging Tray
Published 2016
Series QorIQ? Layerscape
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 780
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B780
Supply Voltage-Max (Vsup) 1.03V
Supply Voltage-Min (Vsup) 0.97V
Number of I/O 76
Speed 1.4GHz
Core Processor ARM? Cortex?-A72
Address Bus Width 14
Boundary Scan YES
External Data Bus Width 64
Ethernet 10GbE (2), 2.5GbE (1), 1GbE (4)
Number of Cores/Bus Width 2 Core 64-Bit
RAM Controllers DDR4
USB USB 3.0 (3) + PHY
Bus Compatibility I2C, PCI, SPI, UART, USB
Security Features Secure Boot, TrustZone?
SATA SATA 6Gbps (1)

Compliance

RoHS Status ROHS3 Compliant

Dimensions

Height Seated (Max) 2.61mm
Length 23mm

Alternative Model

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