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PCX755CVZFU400LE

Microchip Technology
RoHS
/
Package 360-BBGA Exposed Pad
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description IC MPU POWERPC 400MHZ 360BGA
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Technical Details

Physical

Package / Case 360-BBGA Exposed Pad
Supplier Device Package 360-PBGA (25x25)

Technical

Operating Temperature -40°C~110°C TJ
Packaging Tray
Published 2006
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PCX755
Speed 400MHz
Core Processor PowerPC
Voltage - I/O 2.5V 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No

Compliance

RoHS Status Non-RoHS Compliant

Alternative Model

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