MC68EN360CZQ25L

NXP USA Inc.

RoHS

Package 357-BBGA

Category Integrated Circuits (ICs) / Embedded - Microprocessors

Description CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 357-PBGA (25x25)

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Inventory: 503

Minimum: 1

Total Price: USD $120.7

Unit Price: USD $120.70212

≥1 USD $120.70212

Technical Details

Physical

Package / Case 357-BBGA

Surface Mount YES

Dimensions

Height Seated (Max) 1.86mm

Length 25mm

Technical

Operating Temperature -40°C~85°C TA

Packaging Tray

Published 1995

Series M683xx

JESD-609 Code e0

Part Status Last Time Buy

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Number of Terminations 357

ECCN Code 3A991.A.2

Terminal Finish Tin/Lead (Sn/Pb)

HTS Code 8542.31.00.01

Technology HCMOS

Terminal Position BOTTOM

Terminal Form BALL

Peak Reflow Temperature (Cel) 260

Supply Voltage 5V

Terminal Pitch 1.27mm

Time@Peak Reflow Temperature-Max (s) 40

Base Part Number MC68EN360

JESD-30 Code S-PBGA-B357

Supply Voltage-Max (Vsup) 5.25V

Supply Voltage-Min (Vsup) 4.75V

Number of I/O 46

Speed 25MHz

uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

Core Processor CPU32+

Clock Frequency 6MHz

Bit Size 32

Has ADC NO

DMA Channels YES

PWM Channels NO

DAC Channels NO

Address Bus Width 32

External Data Bus Width 32

Voltage - I/O 5.0V

Ethernet 10Mbps (1)

Number of Cores/Bus Width 1 Core 32-Bit

Graphics Acceleration No

RAM Controllers DRAM

Additional Interfaces SCC, SMC, SPI

Co-Processors/DSP Communications; CPM

Compliance

RoHS Status Non-RoHS Compliant

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