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P2010NSN2NHC

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 689-BBGA Exposed Pad
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description IC MPU Q OR IQ 1.2GHZ 689TEPBGA
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Technical Details

Physical

Package / Case 689-BBGA Exposed Pad
Surface Mount YES

Dimensions

Height Seated (Max) 2.46mm
Length 31mm

Technical

Operating Temperature 0°C~125°C TA
Packaging Tray
Published 2002
Series QorIQ P2
JESD-609 Code e2
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 689
ECCN Code 3A991.A.2
Terminal Finish TIN COPPER/TIN SILVER
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.05V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number P2010
JESD-30 Code S-PBGA-B689
Supply Voltage-Max (Vsup) 1.1V
Supply Voltage-Min (Vsup) 1V
Speed 1.2GHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC e500v2
Clock Frequency 100MHz
Address Bus Width 16
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Ethernet 10/100/1000Mbps (3)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR2, DDR3
USB USB 2.0 + PHY (2)
Additional Interfaces DUART, I2C, MMC/SD, SPI

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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