MC8641DVJ1333JE

NXP USA Inc.

RoHS

RoHS compliant

Package 1023-BCBGA, FCCBGA

Category Integrated Circuits (ICs) / Embedded - Microprocessors

Description 32-Bit Power Architecture SoC, 2 X 1333MHz, DDR1/2, AltiVec, GbE, PCI-e, SRIO, 0 to 105C, Rev 3

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Inventory: 84

Minimum: 1

Total Price: USD $677.41

Unit Price: USD $677.407238

≥1 USD $677.407238

Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Technical

Operating Temperature 0°C~105°C TA

Packaging Tray

Published 2001

Series MPC86xx

JESD-609 Code e2

Part Status Active

Moisture Sensitivity Level (MSL) 3 (168 Hours)

ECCN Code 3A991.A.1

Terminal Finish TIN COPPER/TIN SILVER

HTS Code 8542.31.00.01

Technology CMOS

Terminal Position BOTTOM

Terminal Form BALL

Peak Reflow Temperature (Cel) 245

Supply Voltage 1.05V

Terminal Pitch 1mm

Time@Peak Reflow Temperature-Max (s) 30

JESD-30 Code S-CBGA-B1023

Supply Voltage-Max (Vsup) 1.1V

Supply Voltage-Min (Vsup) 1V

Speed 1.333GHz

uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Core Processor PowerPC e600

Bit Size 32

Address Bus Width 16

Boundary Scan YES

Low Power Mode YES

External Data Bus Width 64

Format FLOATING POINT

Integrated Cache YES

Voltage - I/O 1.8V 2.5V 3.3V

Ethernet 10/100/1000Mbps (4)

Number of Cores/Bus Width 2 Core 32-Bit

Graphics Acceleration No

RAM Controllers DDR, DDR2

Additional Interfaces DUART, HSSI, I2C, RapidIO

Physical

Package / Case 1023-BCBGA, FCCBGA

Surface Mount YES

Dimensions

Height Seated (Max) 2.77mm

Length 33mm

Compliance

RoHS Status ROHS3 Compliant

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