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MCIMX6L3EVN10AC

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 432-TFBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description I.MX 6SL ROM PERF ENHAN
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Technical Details

Physical

Package / Case 432-TFBGA
Surface Mount YES

Dimensions

Height Seated (Max) 1.1mm
Length 13mm

Technical

Operating Temperature -40°C~105°C TA
Packaging Tray
Series i.MX6SL
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PBGA-B
Supply Voltage-Max (Vsup) 1.5V
Supply Voltage-Min (Vsup) 1.375V
Speed 1.0GHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor ARM? Cortex?-A9
Voltage - I/O 1.2V 1.8V 3.0V
Ethernet 10/100Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, LVDDR3, DDR3
USB USB 2.0 + PHY (3)
Additional Interfaces AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Co-Processors/DSP Multimedia; NEON? SIMD
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers Keypad, LCD

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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