XE167F96F66LACFXUMA1

Infineon Technologies

RoHS

RoHS compliant

Package 144-LQFP Exposed Pad

Category Integrated Circuits (ICs) / Embedded - Microcontrollers

Description MCU 16-bit XE166 CISC/DSP/RISC 768KB Flash 3.3V 144-Pin LQFP EP

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Technical Details

Physical

Mount Surface Mount

Mounting Type Surface Mount

Package / Case 144-LQFP Exposed Pad

Number of Pins 144

Technical

Operating Temperature -40°C~85°C TA

Packaging Tape & Reel (TR)

Published 2008

Series XE16x

JESD-609 Code e3

Part Status Not For New Designs

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Terminal Finish Tin (Sn)

HTS Code 8542.31.00.01

Max Power Dissipation 1W

Technology CMOS

Peak Reflow Temperature (Cel) NOT SPECIFIED

Frequency 66MHz

Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Operating Supply Voltage 3.3V

Interface CAN, I2C, I2S, LIN, SPI, UART

Memory Size 768kB

Oscillator Type Internal

Number of I/O 118

RAM Size 82K x 8

Voltage - Supply (Vcc/Vdd) 3V~5.5V

uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

Core Processor C166SV2

Peripherals I2S, POR, PWM, WDT

Program Memory Type FLASH

Core Size 16-Bit

Program Memory Size 768KB 768K x 8

Connectivity CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI

Data Converter A/D 24x10b

Watchdog Timer Yes

Data Bus Width 16b

Number of Timers/Counters 11

Compliance

RoHS Status ROHS3 Compliant

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