XE164F24F66LACFXUMA1

Infineon Technologies

RoHS

RoHS compliant

Package 100-LQFP Exposed Pad

Category Integrated Circuits (ICs) / Embedded - Microcontrollers

Description MCU 16-bit XE166 CISC/DSP/RISC 192KB Flash 3.3V/5V 100-Pin LQFP EP

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Technical Details

Supply Chain

Factory Lead Time 52 Weeks

Physical

Mount Surface Mount

Mounting Type Surface Mount

Package / Case 100-LQFP Exposed Pad

Number of Pins 100

Compliance

RoHS Status ROHS3 Compliant

Technical

Operating Temperature -40°C~85°C TA

Packaging Tape & Reel (TR)

Published 2008

Series XE16x

Part Status Not For New Designs

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Number of Terminations 100

Subcategory Microcontrollers

Max Power Dissipation 1W

Technology CMOS

Terminal Position QUAD

Terminal Form GULL WING

Frequency 66MHz

Qualification Status Not Qualified

Interface CAN, EBI/EMI, I2C, LIN, SPI, UART, USART

Memory Size 192kB

Oscillator Type Internal

Number of I/O 75

Speed 80 MHz

RAM Size 24K x 8

Voltage - Supply (Vcc/Vdd) 3V~5.5V

Core Processor C166SV2

Peripherals I2S, POR, PWM, WDT

Program Memory Type FLASH

Core Size 16-Bit

Program Memory Size 192KB 192K x 8

Connectivity CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI

Bit Size 16

Data Converter A/D 16x10b

Data Bus Width 16b

Number of Timers/Counters 5

ROM (words) 196608

RAM (bytes) 10240

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