Operating Temperature -40°C~125°C TJ
Packaging Tape & Reel (TR)
Published 2008
Series i.MX53
JESD-609 Code e2
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 529
ECCN Code 5A992
Terminal Finish TIN COPPER/TIN SILVER
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.1V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MCIMX534
JESD-30 Code S-PBGA-B529
Supply Voltage-Max (Vsup) 1.15V
Supply Voltage-Min (Vsup) 1.05V
Speed 800MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor ARM? Cortex?-A8
Clock Frequency 27MHz
Bit Size 32
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 1.3V 1.8V 2.775V 3.3V
Ethernet 10/100Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, DDR2, DDR3
USB USB 2.0 (2), USB 2.0 + PHY (2)
Additional Interfaces 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Co-Processors/DSP Multimedia; NEON? SIMD
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers Keypad, LCD
SATA SATA 1.5Gbps (1)