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MPC8313EZQADDC

NXP USA Inc.
RoHS
/
Package 516-BBGA Exposed Pad
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description Microprocessors - MPU 8313 REV2.2 PB W/ENC
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Technical Details

Supply Chain

Factory Lead Time 8 Weeks

Dimensions

Height Seated (Max) 2.55mm
Length 27mm

Compliance

RoHS Status Non-RoHS Compliant

Technical

Operating Temperature 0°C~105°C TA
Packaging Tray
Published 2002
Series MPC83xx
JESD-609 Code e0
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 516
ECCN Code 5A002.A.1
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC8313
JESD-30 Code S-PBGA-B516
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Speed 267MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC e300c3
Address Bus Width 15
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 1.8V 2.5V 3.3V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR, DDR2
USB USB 2.0 + PHY (1)
Additional Interfaces DUART, HSSI, I2C, PCI, SPI
Co-Processors/DSP Security; SEC 2.2
Security Features Cryptography

Alternative Model

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