Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2014
Series Vybrid, VF5xxR
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 364
ECCN Code 5A002.A.1
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.23V
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PBGA-B364
Supply Voltage-Max (Vsup) 1.26V
Supply Voltage-Min (Vsup) 1.16V
Speed 400MHz, 133MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor ARM? Cortex?-A5 + Cortex?-M4
Boundary Scan YES
Low Power Mode YES
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10/100Mbps (2)
Number of Cores/Bus Width 2 Core 32-Bit
Graphics Acceleration No
RAM Controllers LPDDR2, DDR3, DRAM
USB USB 2.0 OTG + PHY (1)
Additional Interfaces CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Co-Processors/DSP Multimedia; NEON? MPE
Security Features ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers DCU, GPU, LCD, VideoADC, VIU