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MPC8555PXAQF
NXP USA Inc.RoHS
/
Package 783-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description
Microprocessors - MPU PQ 37 LITE 8555
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Technical Details
Physical
Package / Case 783-BBGA, FCBGA
Supplier Device Package 783-FCPBGA (29x29)
Technical
Operating Temperature 0°C~105°C TA
Packaging Tray
Published 2004
Series MPC85xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MPC8555
Speed 1.0GHz
Core Processor PowerPC e500
Voltage - I/O 2.5V 3.3V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR, SDRAM
USB USB 2.0 (1)
Additional Interfaces DUART, I2C, PCI, SPI, TDM, UART
Co-Processors/DSP Communications; CPM
Compliance
RoHS Status Non-RoHS Compliant
Alternative Model
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