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MPC850SRZQ80BU

NXP USA Inc.
RoHS
/
Package 256-BBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 256-PBGA (23x23)
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Technical Details

Supply Chain

Factory Lead Time 26 Weeks

Physical

Package / Case 256-BBGA
Surface Mount YES

Technical

Operating Temperature 0°C~95°C TA
Packaging Tray
Published 1998
Series MPC8xx
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code 5A991
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Subcategory Microprocessors
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC850
JESD-30 Code S-PBGA-B256
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Speed 80MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM

Compliance

RoHS Status Non-RoHS Compliant

Alternative Model

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