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MPC850DEVR50BU

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 256-BBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description MPU PowerQUICC MPC8xx Processor RISC 32bit 50MHz 3.3V/5V 256-Pin BGA Tray
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Technical Details

Physical

Package / Case 256-BBGA
Surface Mount YES

Technical

Operating Temperature 0°C~95°C TA
Packaging Tray
Published 1997
Series MPC8xx
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Subcategory Microprocessors
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC850
JESD-30 Code S-PBGA-B256
Supply Voltage-Max (Vsup) 3.465V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3.135V
Speed 50MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Clock Frequency 50MHz
Bit Size 32
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM

Dimensions

Height Seated (Max) 2.35mm
Length 23mm

Compliance

RoHS Status ROHS3 Compliant
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