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MPC8555PXALF
NXP USA Inc.RoHS
/
Package 783-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description
Microprocessors - MPU PQ 37 LITE 8555
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Inventory: 898
Minimum: 1
Total Price: USD $178.41
Unit Price: USD $178.40592
≥1 USD $178.40592
Technical Details
Physical
Package / Case 783-BBGA, FCBGA
Surface Mount YES
Technical
Operating Temperature 0°C~105°C TA
Packaging Tray
Published 2004
Series MPC85xx
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 783
ECCN Code 5A992
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number MPC8555
JESD-30 Code S-PBGA-B783
Supply Voltage-Max (Vsup) 1.26V
Supply Voltage-Min (Vsup) 1.14V
Speed 667MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC e500
Clock Frequency 166MHz
Bit Size 32
Address Bus Width 64
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 2.5V 3.3V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR, SDRAM
USB USB 2.0 (1)
Additional Interfaces DUART, I2C, PCI, SPI, TDM, UART
Co-Processors/DSP Communications; CPM
Compliance
RoHS Status Non-RoHS Compliant
Dimensions
Height Seated (Max) 3.75mm
Length 29mm
Alternative Model
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