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MPC859PCZP100A

NXP USA Inc.
RoHS
/
Package 357-BBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 100MHz 357-PBGA (25x25)
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Technical Details

Physical

Package / Case 357-BBGA
Surface Mount YES

Technical

Operating Temperature -40°C~100°C TA
Packaging Tray
Published 2002
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 357
ECCN Code 3A001.A.3
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Base Part Number MPC859
JESD-30 Code S-PBGA-B357
Supply Voltage-Max (Vsup) 1.9V
Supply Voltage-Min (Vsup) 1.7V
Speed 100MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Clock Frequency 50MHz
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP Communications; CPM

Compliance

RoHS Status Non-RoHS Compliant

Dimensions

Height Seated (Max) 2.52mm
Length 25mm

Alternative Model

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