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KMPC8555EPXAPF

NXP USA Inc.
RoHS
/
Package 783-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description Microprocessors - MPU PQ 37 LITE 8555E
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Technical Details

Physical

Package / Case 783-BBGA, FCBGA
Supplier Device Package 783-FCPBGA (29x29)

Technical

Operating Temperature 0°C~105°C TA
Packaging Tray
Published 2004
Series MPC85xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MPC8555
Speed 833MHz
Core Processor PowerPC e500
Voltage - I/O 2.5V 3.3V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR, SDRAM
USB USB 2.0 (1)
Additional Interfaces DUART, I2C, PCI, SPI, TDM, UART
Co-Processors/DSP Communications; CPM, Security; SEC
Security Features Cryptography, Random Number Generator

Compliance

RoHS Status Non-RoHS Compliant

Alternative Model

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