KMPC860DTCZQ50D4

NXP USA Inc.

RoHS

Package 357-BBGA

Category Integrated Circuits (ICs) / Embedded - Microprocessors

Description MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)

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Technical Details

Physical

Package / Case 357-BBGA

Technical

Operating Temperature -40°C~95°C TA

Packaging Tray

Published 2004

Series MPC8xx

Part Status Obsolete

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Base Part Number MPC860

Speed 50MHz

Voltage - I/O 3.3V

Ethernet 10Mbps (2), 10/100Mbps (1)

Number of Cores/Bus Width 1 Core 32-Bit

Graphics Acceleration No

RAM Controllers DRAM

Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Co-Processors/DSP Communications; CPM

Compliance

RoHS Status Non-RoHS Compliant

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