MPC745BPX350LE

NXP USA Inc.

RoHS

Package 255-BBGA, FCBGA

Category Integrated Circuits (ICs) / Embedded - Microprocessors

Description Microprocessors - MPU 255 PBGAREV2.8105C

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Technical Details

Physical

Package / Case 255-BBGA, FCBGA

Surface Mount YES

Technical

Operating Temperature 0°C~105°C TA

Packaging Tray

Published 2001

Series MPC7xx

JESD-609 Code e0

Part Status Obsolete

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Number of Terminations 255

ECCN Code 3A991

Terminal Finish TIN LEAD

Additional Feature ALSO REQUIRES 2.5V OR 3.3V SUPPLY

HTS Code 8542.31.00.01

Technology CMOS

Terminal Position BOTTOM

Terminal Form BALL

Peak Reflow Temperature (Cel) 245

Supply Voltage 2V

Terminal Pitch 1.27mm

Time@Peak Reflow Temperature-Max (s) 30

Base Part Number MPC745

JESD-30 Code S-PBGA-B255

Supply Voltage-Max (Vsup) 2.1V

Supply Voltage-Min (Vsup) 1.8V

Speed 350MHz

uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Core Processor PowerPC

Clock Frequency 100MHz

Bit Size 32

Address Bus Width 32

Boundary Scan YES

Low Power Mode YES

External Data Bus Width 64

Format FLOATING POINT

Integrated Cache YES

Voltage - I/O 2.5V 3.3V

Number of Cores/Bus Width 1 Core 32-Bit

Graphics Acceleration No

Dimensions

Height Seated (Max) 2.8mm

Length 21mm

Compliance

RoHS Status Non-RoHS Compliant

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