XPC850DEZT66BUR2

NXP USA Inc.

RoHS

Package 256-BGA

Category Integrated Circuits (ICs) / Embedded - Microprocessors

Description MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23)

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Technical Details

Physical

Package / Case 256-BGA

Technical

Operating Temperature 0°C~95°C TA

Packaging Tape & Reel (TR)

Published 2004

Series MPC8xx

Part Status Obsolete

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Base Part Number PC850

Speed 66MHz

Voltage - I/O 3.3V

Ethernet 10Mbps (1)

Number of Cores/Bus Width 1 Core 32-Bit

Graphics Acceleration No

RAM Controllers DRAM

USB USB 1.x (1)

Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Co-Processors/DSP Communications; CPM

Compliance

RoHS Status Non-RoHS Compliant

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