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MC8610TPX1066JB

NXP USA Inc.
RoHS
/
Package 783-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description PowerPC e600 Microprocessor IC MPC86xx 1 Core, 32-Bit 1.066GHz 783-FCPBGA (29x29)
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Technical Details

Physical

Package / Case 783-BBGA, FCBGA
Surface Mount YES

Dimensions

Height Seated (Max) 2.7mm
Length 29mm

Compliance

RoHS Status Non-RoHS Compliant

Technical

Operating Temperature -40°C~105°C TA
Packaging Tray
Published 2001
Series MPC86xx
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 783
ECCN Code 3A991.A.1
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number MC8610
JESD-30 Code S-PBGA-B783
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Speed 1.066GHz
Core Processor PowerPC e600
Bit Size 32
Address Bus Width 16
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 1.8V 2.5V 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR, DDR2
Additional Interfaces AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI
Display & Interface Controllers DIU, LCD

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