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P1016NXE5FFB

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 561-FBGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description Microprocessors - MPU 667/333/667 ETWE QE R1.1
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Technical Details

Physical

Package / Case 561-FBGA
Supplier Device Package 561-TEPBGA I (23x23)

Technical

Operating Temperature -40°C~125°C TA
Packaging Tray
Series QorIQ P1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number P1016
Speed 667MHz
Core Processor PowerPC e500v2
Ethernet 10/100/1000Mbps (3)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR2, DDR3
USB USB 2.0 + PHY (2)
Additional Interfaces DUART, I2C, MMC/SD, SPI
Co-Processors/DSP Communications; QUICC Engine, Security; SEC 3.3
Security Features Cryptography, Random Number Generator

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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