P1025NXN5DFB

NXP USA Inc.

RoHS

RoHS compliant

Package 561-FBGA

Category Integrated Circuits (ICs) / Embedded - Microprocessors

Description Microprocessors - MPU 533/333/667 ETNE QE r1.1

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Technical Details

Physical

Package / Case 561-FBGA

Technical

Operating Temperature -40°C~125°C TA

Packaging Tray

Series QorIQ P1

Part Status Obsolete

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Base Part Number P1025

Speed 667MHz

Core Processor PowerPC e500v2

Ethernet 10/100/1000Mbps (3)

Number of Cores/Bus Width 2 Core 32-Bit

Graphics Acceleration No

RAM Controllers DDR2, DDR3

USB USB 2.0 + PHY (2)

Additional Interfaces DUART, I2C, MMC/SD, SPI

Co-Processors/DSP Communications; QUICC Engine

Compliance

RoHS Status ROHS3 Compliant

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