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MKL27Z128VMP4

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 64-LFBGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description MCU 32-Bit KL27 ARM Cortex M0+ RISC 128KB Flash 1.8V/2.5V/3.3V 64-Pin MAPBGA Tray
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Technical Details

Supply Chain

Factory Lead Time 13 Weeks

Physical

Mounting Type Surface Mount
Package / Case 64-LFBGA
Surface Mount YES

Technical

Operating Temperature -40°C~105°C TA
Packaging Tray
Published 2002
Series Kinetis KL2
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature DIFFERENTIAL ANALOG CHANNEL INPUTS: 2-CH 16-BIT
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PBGA-B64
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 1.71V
Oscillator Type Internal
Number of I/O 50
Speed 48MHz
RAM Size 32K x 8
Voltage - Supply (Vcc/Vdd) 1.71V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM? Cortex?-M0+
Peripherals DMA, I2S, LVD, POR, PWM, WDT
Clock Frequency 48MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 128KB 128K x 8
Connectivity I2C, SPI, UART/USART, USB
Data Converter A/D 16x16b; D/A 1x12b
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES

Compliance

RoHS Status ROHS3 Compliant
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