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XL232-1024-FB374-I40

XMOS
RoHS
RoHS RoHS compliant
Package 374-LFBGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description IC MCU 32BIT ROMLESS 374FBGA
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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Mounting Type Surface Mount
Package / Case 374-LFBGA
Number of Pins 374
Supplier Device Package 374-FBGA (18x18)

Technical

Operating Temperature -40°C~85°C TA
Packaging Tray
Series XL
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Oscillator Type External
Number of I/O 176
Speed 4000MIPS
RAM Size 1M x 8
Memory Type ROMless
Voltage - Supply (Vcc/Vdd) 0.95V~3.6V
Core Processor XCore
Program Memory Type ROMless
Core Size 32-Bit 24-Core
Core Architecture XCore

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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