MKL17Z256CAL4R

NXP USA Inc.

RoHS

RoHS compliant

Package 36-UFBGA, WLCSP

Category Integrated Circuits (ICs) / Embedded - Microcontrollers

Description MCU 48MHz ARM Cortex-M0+ Ultra-Low Power 256KB Flash 32KB SRAM 36WLCSP

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Technical Details

Supply Chain

Factory Lead Time 16 Weeks

Physical

Mounting Type Surface Mount

Package / Case 36-UFBGA, WLCSP

Surface Mount YES

Technical

Operating Temperature -40°C~85°C TA

Packaging Tape & Reel (TR)

Published 2002

Series Kinetis KL1

Part Status Active

Moisture Sensitivity Level (MSL) 1 (Unlimited)

Number of Terminations 36

ECCN Code 3A991.A.2

HTS Code 8542.31.00.01

Technology CMOS

Terminal Position BOTTOM

Terminal Form BALL

Peak Reflow Temperature (Cel) 260

Supply Voltage 3V

Terminal Pitch 0.4mm

Time@Peak Reflow Temperature-Max (s) 40

Supply Voltage-Max (Vsup) 3.6V

Supply Voltage-Min (Vsup) 1.71V

Oscillator Type Internal

Number of I/O 26

Speed 48MHz

RAM Size 32K x 8

Voltage - Supply (Vcc/Vdd) 1.71V~3.6V

uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

Core Processor ARM? Cortex?-M0+

Peripherals Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT

Clock Frequency 48MHz

Program Memory Type FLASH

Core Size 32-Bit

Program Memory Size 256KB 256K x 8

Connectivity I2C, LINbus, SPI, UART/USART

Data Converter A/D 7x16b; D/A 1x12b

Has ADC YES

DMA Channels YES

PWM Channels YES

Compliance

RoHS Status ROHS3 Compliant

Dimensions

Length 2.8mm

Width 2.7mm

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