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LPC2146FBD64,557

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 64-LQFP
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description MCU 16-bit/32-bit LPC2100 ARM7TDMI-S RISC 256KB Flash 3.3V 64-Pin LQFP Tray
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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Mounting Type Surface Mount
Package / Case 64-LQFP
Surface Mount YES

Technical

Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2003
Series LPC2100
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 2 (1 Year)
Number of Terminations 64
Terminal Finish Tin (Sn)
Subcategory Microcontrollers
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number LPC214*
Pin Count 64
JESD-30 Code S-PQFP-G64
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Oscillator Type Internal
Number of I/O 45
Speed 60MHz
RAM Size 40K x 8
Voltage - Supply (Vcc/Vdd) 3V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM7?
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT
Clock Frequency 25MHz
Program Memory Type FLASH
Core Size 16/32-Bit
Program Memory Size 256KB 256K x 8
Connectivity I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Bit Size 32
Data Converter A/D 14x10b; D/A 1x10b
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels YES
ROM (words) 262144
Source Url Status Check Date 2013-06-14 00:00:00

Dimensions

Height Seated (Max) 1.6mm
Length 10mm
Width 10mm

Compliance

RoHS Status ROHS3 Compliant
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