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SPC5744PK1AMMM9R

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 257-LFBGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description NXP 32-BIT MCU DUAL CORE POWER A
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Technical Details

Supply Chain

Factory Lead Time 16 Weeks

Physical

Mounting Type Surface Mount
Package / Case 257-LFBGA

Technical

Operating Temperature -40°C~125°C TA
Packaging Tape & Reel (TR)
Series MPC57xx
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Oscillator Type Internal
Speed 80MHz, 200MHz
RAM Size 384K x 8
Voltage - Supply (Vcc/Vdd) 3.15V~5.5V
Core Processor e200z2, e200z4
Peripherals DMA, I2S, POR, WDT
Program Memory Type FLASH
Core Size 32-Bit Dual-Core
Program Memory Size 2.5MB 2.5M x 8
Connectivity CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Data Converter A/D 36x10b, 16x12b
EEPROM Size 64K x 8

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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