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XS1-L02A-QF124-C5-THS

XMOS
RoHS
RoHS RoHS compliant
Package 124-TFQFN Dual Rows, Exposed Pad
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description IC MCU 32BIT 128KB SRAM 124QFN
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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Mounting Type Surface Mount
Package / Case 124-TFQFN Dual Rows, Exposed Pad
Supplier Device Package 124-QFN DualRow (10x10)

Technical

Operating Temperature 0°C~70°C TA
Packaging Tray
Published 2010
Series XS1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Interface USB
Memory Size 128kB
Oscillator Type External
Number of I/O 84
Speed 500MIPS
Memory Type SRAM
Voltage - Supply (Vcc/Vdd) 0.95V~3.6V
Core Processor XCore
Program Memory Type SRAM
Core Size 32-Bit Dual-Core
Program Memory Size 128KB 32K x 32
Connectivity Configurable
Core Architecture XCore

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

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