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Embedded - System On Chip (SoC)
A2F200M3F-1FGG256I

A2F200M3F-1FGG256I

Microsemi Corporation

RoHS

RoHS compliant

Package 256-LBGA

Category Integrated Circuits (ICs) / Embedded - System On Chip (SoC)

Description IC FPGA 200K GATES 256KB 256-BGA

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Inventory: 7566

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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Package / Case 256-LBGA

Supplier Device Package 256-FPBGA (17x17)

Technical

Operating Temperature -40°C~100°C TJ

Packaging Tray

Published 2015

Series SmartFusion?

Part Status Active

Moisture Sensitivity Level (MSL) 3 (168 Hours)

Base Part Number A2F200

Number of I/O MCU - 25, FPGA - 66

Speed 100MHz

RAM Size 64KB

Core Processor ARM? Cortex?-M3

Peripherals DMA, POR, WDT

Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART

Architecture MCU, FPGA

Primary Attributes ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops

Flash Size 256KB

Compliance

RoHS Status RoHS Compliant

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